HSP-1参数:THERMAL PAD SINGLE PHASE
类别:风扇,热管理-热 - 垫,片其它有关文件: DeclarationofConformity标准包装:25系列:HSP应用:单相SSR,M50电源模块形状:矩形外形:57.15mmx44.45mm厚度:0.003"(0.076mm)材料:-粘合剂:-底布,载体:-颜色:白热阻率:-导热率:1.0W/m-K配用:H16WD6025G-10-ND-RELAYSSR25A660VACRANDDCINH16WD6090G-10-ND-RELAYSSR90A660VACRANDDCINH16WD6090G-ND-RELAYSSR90A660VACZERODCINH16WD6075G-10-ND-RELAYSSR75A660VACRANDDCINH16WD6075G-ND-RELAYSSR75A660VACZERODCINH16WD6050G-10-ND-RELAYSSR50A660VACRANDDCINH16WD6050G-ND-RELAYSSR50A660VACZERODCINH16WD6025G-ND-RELAYSSR25A660VACZERODCINCC1881-ND-RELAYSSR90A660VACRANDDCINCC1880-ND-RELAYSSR90A660VACZERODCIN更多...